Texas Instruments Lehi Fab
Large load · 4000 N. FLASH DRIVE, Lehi, UT
Texas Instruments operates a 300-mm wafer fab in Lehi, Utah, known as LFAB1, which began producing analog and embedded processors at the end of 2022. TI broke ground in November 2023 on LFAB2, a second 300-mm fab that will connect to LFAB1 as part of an $11 billion investment.
Overview
TI acquired the existing 300-mm wafer fab in Lehi from memory maker Micron Technologies in 2021, and that facility is known as LFAB1. A November 2023 report said LFAB1 started producing analog and embedded processors at the end of the previous year. TI's Utah fabs are designed to manufacture tens of millions of analog and embedded processing chips every day at full production, and LFAB2 will connect to that site.
Profile
- LFAB2 investment and jobs
- TI's $11 billion investment in LFAB2, with anticipated support from the US CHIPS and Science Act, is expected to create approximately 800 additional TI jobs as well as thousands of indirect jobs, with first production available as early as 2026. Supply Chain Dive reported that the release described the project as the largest economic investment in Utah history. TI President and Chief Executive Officer Haviv Ilan led the groundbreaking with Utah Governor Spencer Cox and local officials in November 2023.
- Power and sustainability goals
- LFAB2 has a goal to be powered by 100% renewable electricity, and the fab is designed to meet one of the highest levels of the LEED building rating system for structural efficiency and sustainability, LEED Gold version 4. Advanced 300-mm equipment and processes in Lehi are expected to reduce waste, water and energy consumption, and LFAB2 is expected to recycle water at nearly twice the rate of LFAB1. These are goals and design targets in TI's announcements, not measured load figures.
Facility
- Activity
- Analog and embedded processing chips (300-mm wafer fabrication)
- Industry
- Manufacturing
- Site type
- Facility
- Operating status
- Operating
Related records
Timeline
- Nov 7, 2023
- TI breaks ground on LFAB2, a new 300-mm fab in Lehi, Utah
Texas Instruments breaks ground on new 300-mm semiconductor wafer fabrication plant in Utah – Utah Business